Industries > Semiconductor > Semiconductor Application - CMP CUP Lifting
Semiconductor Application - CMP CUP Lifting
Lifting mechanism in semiconductor tool requires high torque and synchronous motion in a small footprint. CMP CUP lifting is the part of the wafer cleaning equipment, which has gradually become the mainstream wet cleaning equipment in semiconductor manufacturing due to its effective process, high uniformity, and low cross contamination.
Common Requests
- Synchronized move
- Compact
- Self locking (holding force)
Solutions
Suitable for Simple and Cost Effective Needs
Stepper Motor Linear Actuator Attachment
- Linear motion mechanism with a leadscrew and a resin nut
- Saves space and reduces design time compared to a custom-built mechanism
- Self-locking force 100 N (lead 2 mm) capable of load holding
- To use with 2-Phase and 5-Phase stepper motors PKP Series
Suitable for High-Precision Applications
DR/DRS2 Series Compact Electric Cylinders
- Entire linear motion mechanism in a compact design
- Highly responsive and reliable αSTEP closed-loop technology
- Preassembled for quality and convenience
Engineering Notes
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