Spraying / Cleaning Device (Nozzle) Swing Arm

Semiconductor Application - Spraying / Cleaning Device (Nozzle) Swing Arm

Cleaning tool application requires high torque, precise positioning, and the ability to control torque. Spraying and cleaning process is the part of the wafer cleaning equipment, which has gradually become the mainstream wet cleaning equipment in semiconductor manufacturing due to its effective process, high uniformity, and low cross contamination. 

Common Requests

  • High inertia / load
  • Hollow shaft

Solutions

Suitable for Swing Arm Axis

DGII Series Hollow Rotary Actuators

DGII Series Hollow Rotary Actuators

  • Powerful and rigid design
  • Large hollow bore diameter
  • Highly responsive and reliable αSTEP closed-loop technology

Suitable for Lifting Axis

DR/DRS2 Series Compact Electric Cylinders

DR/DRS2 Series Compact Electric Cylinders

  • Entire linear motion mechanism in a compact design
  • Highly responsive and reliable αSTEP closed-loop technology
  • Preassembled for quality and convenience


Engineering Notes
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